发明名称 Electronic device
摘要 An electronic device includes a motherboard, at least one heat dissipation module, a fan module and a wind scooper. The heat dissipation module is arranged on the motherboard and provided with a first positioning component. The fan module is arranged on one side of the motherboard and faces the heat dissipation module. The wind scooper has a second positioning component corresponding to the first positioning component. The wind scooper is fixed on the heat dissipation module through the cooperation between the first positioning component and the second positioning component. The wind scooper is connected between the fan module and the heat dissipation modules, so that the airflow provided by the fan module can flow through the heat dissipation module.
申请公布号 US9195283(B2) 申请公布日期 2015.11.24
申请号 US201313776678 申请日期 2013.02.25
申请人 Inventec (Pudong) Technology Corporation;INVENTEC CORPORATION 发明人 Chen Jing;Chen Chien-Lung
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
代理机构 CKC & Partners Co., Ltd. 代理人 CKC & Partners Co., Ltd.
主权项 1. An electronic device, comprising: a motherboard; at least one heat dissipation module, arranged on the motherboard and provided with a first positioning component, the first positioning component being a fastening convex component; a fan module arranged on one side of the motherboard and facing the heat dissipation module; and a wind, scooper, provided with a second positioning component corresponding to the first positioning component, wherein the second positioning component is a fastener arranged on the wind scooper, the fastener has a fastening hook component; the wind scooper is fixed on the heat dissipation module through the fastening hook component being fastened to a lower edge of the fastening convex component in an assembly direction, and the fastening hook component is unfastened from the fastening convex component when the fastening hook component is squeezed by the fastening convex component along a direction substantially perpendicular to the assembly direction; and the wind scooper is connected between the fan module and the heat dissipation module, so that the airflow provided by the fan module flows through the heat dissipation module.
地址 Shanghai CN