Vertically-oriented immersion server with vapor bubble deflector

摘要

An immersion server includes: a first surface that is exposed when the server is submerged within a cooling liquid; and at least one vapor bubble deflector physically abutting the first surface and extending away from the first surface at an angle. The deflector divides the first surface into an upper segment and a lower segment when the server is upright. When the server is submerged, the cooling liquid surrounding the lower segment absorbs sufficient heat to evaporate and generate vapor bubbles rising to the liquid surface. The vapor bubble deflector deflects the rising vapor bubbles away from the surface of the upper segment. This enables superior liquid contact with heat dissipating components at the upper segment and better cooling of those components. The deflector can be a device-level deflector separating two or more components or a component-level deflector separating a lower segment from an upper segment of a single component.

主权项

1. A server comprising:
a printed circuit board (PCB) having a first surface at which one or more components are physically connected; a vapor bubble deflector having a first end physically abutting the first surface of the PCB and an opposing, second end that extends away from the first surface at an angle, wherein the deflector segregates the first surface of the PCB into an upper segment and a lower segment when the server is placed in a vertically upright orientation; a first heat dissipating component that is physically coupled to the lower segment of the PCB below the deflector; and a second heat dissipating component that is physically coupled to the upper segment of the PCB above a point of contact between the first end of the deflector and the first surface of the PCB; wherein the vapor bubble deflector is a device level deflector that is positioned between individual components of the server, and the server further includes at least one component level vapor bubble deflectors having a first end abuttin a surface of a single heat generating component of the server to create a separation of the single component into a plurality of vertically aligned/oriented segments to direct rising vapor bubbles from a lower segment of the single component away from an upper segment of a single component; wherein the server is designed for immersion-based liquid cooling by submerging the PCB with the first heat dissipating component and the second heat dissipating component into an immersion cooling vessel containing a cooling liquid that surrounds the first and second heat dissipating components and absorbs heat being dissipated from the first and second heat dissipating components; wherein portions of the cooling liquid surrounding the first heat dissipating component absorbs sufficient heat to reach a boiling point temperate and evaporate to generate one or more rising vapor bubbles that bubble to a surface of the cooling liquid, and wherein the vapor bubble deflector deflects the rising vapor bubbles associated with the first heat dissipating component away from the second heat dissipating component towards the surface of the cooling liquid.