Circuits for self-reconfiguration or intrinsic functional changes of chips before vs. after stacking

摘要

A method and system for testing one or more semiconductor structures, for example, chips or wafers, in a three-dimensional stack. The method and system includes controlling a logic signal of a first circuit in a first chip or wafer connected to a supply voltage to indicate a first state during pre-assembly testing of the first chip or wafer. The method and system further includes controlling the logic signal to indicate a second state when the first circuit is connected to a second circuit of a second chip or wafer resulting in a combined circuit. The combined circuit is in a three-dimensional chip or wafer stack during post-assembly testing of the three-dimensional chip or wafer stack.

主权项

1. A method for testing one or more semiconductor structures for a three-dimensional structure stack, comprising:
controlling a logic signal of a first circuit which includes a first electrical element, the first circuit being part of a first semiconductor structure connected to a supply voltage, the first circuit configured to indicate a first state during pre-assembly testing of the first semiconductor structure, the supply voltage being part of the first circuit at the pre-assembly testing; and controlling the logic signal using the supply voltage of the first circuit to indicate a second state in response to the first circuit being connected to a second circuit which includes a second electrical element, the second circuit being part of a second semiconductor structure and the connection of the first and second circuits resulting in a combined circuit, the combined circuit being in a three-dimensional semiconductor structure stack comprising the first and second semiconductor structures during post-assembly testing of the three-dimensional semiconductor structure stack.