发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
A semiconductor device includes: a layer of a first conductivity type; a well of a second conductivity type on the layer of the first conductivity type in an active region; and a flat RESURF layer of the second conductivity type on the layer of the first conductivity type on an outer circumference of the well as a termination structure. The RESURF layer includes a low concentration layer arranged at an inner end on the well side and an outer end on the outer circumferential side, and a high concentration layer arranged between the inner end and the outer end and having a higher impurity concentration than the low concentration layer. |
申请公布号 |
US9196488(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201414150500 |
申请日期 |
2014.01.08 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
Takahashi Tetsuo |
分类号 |
H01L23/58;H01L21/425;H01L21/265;H01L29/06;H01L21/266;H01L29/40;H01L29/739 |
主分类号 |
H01L23/58 |
代理机构 |
Studebaker & Brackett PC |
代理人 |
Studebaker & Brackett PC |
主权项 |
1. A semiconductor device comprising:
a substrate including a layer of a first conductivity type; a well of a second conductivity type on the layer of the first conductivity type in an active region in a center region of the substrate; and a flat RESURF layer of the second conductivity type on the layer of the first conductivity type on an outer circumference of the well as a termination structure, wherein the RESURF layer includes a low concentration layer arranged at an inner end on the well side and an outer end on the outer circumferential side, and a high concentration layer arranged between the inner end and the outer end and having a higher impurity concentration than the low concentration layer, and the RESURF layer surrounds the active region. |
地址 |
Tokyo JP |