发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes: a layer of a first conductivity type; a well of a second conductivity type on the layer of the first conductivity type in an active region; and a flat RESURF layer of the second conductivity type on the layer of the first conductivity type on an outer circumference of the well as a termination structure. The RESURF layer includes a low concentration layer arranged at an inner end on the well side and an outer end on the outer circumferential side, and a high concentration layer arranged between the inner end and the outer end and having a higher impurity concentration than the low concentration layer.
申请公布号 US9196488(B2) 申请公布日期 2015.11.24
申请号 US201414150500 申请日期 2014.01.08
申请人 Mitsubishi Electric Corporation 发明人 Takahashi Tetsuo
分类号 H01L23/58;H01L21/425;H01L21/265;H01L29/06;H01L21/266;H01L29/40;H01L29/739 主分类号 H01L23/58
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. A semiconductor device comprising: a substrate including a layer of a first conductivity type; a well of a second conductivity type on the layer of the first conductivity type in an active region in a center region of the substrate; and a flat RESURF layer of the second conductivity type on the layer of the first conductivity type on an outer circumference of the well as a termination structure, wherein the RESURF layer includes a low concentration layer arranged at an inner end on the well side and an outer end on the outer circumferential side, and a high concentration layer arranged between the inner end and the outer end and having a higher impurity concentration than the low concentration layer, and the RESURF layer surrounds the active region.
地址 Tokyo JP