Bonding structure and electronic device using the same

摘要

A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.

主权项

1. A bonding structure, comprising:
a first connecting part comprising a top surface and a first joining surface opposite to the top surface; a second connecting part comprising a mounting surface and defining a bonding groove on the mounting surface, the second connecting part further comprising at least one positioning member in the bonding groove, and an adhesive received in the bonding groove of the second connecting part, wherein the first connecting part is received in the bonding groove with the top surface coplanar with the mounting surface of the second connecting part, the first joining surface abuts against the at least one positioning member to position the first connecting part, the adhesive is received between the first joining surface of the first connecting part and a bottom of the bonding groove to combine the first and the second connecting part together, the adhesive covers the bottom of the bonding groove except for a portion of the bottom touching the at least one positioning member.