| 摘要 |
PROBLEM TO BE SOLVED: To achieve a reliable semiconductor device which inhibits separation of an encapsulation resin, which occurs between a semiconductor element and the encapsulation resin in a semiconductor element which is encapsulated by the encapsulation resin and mounted on a metal plate.SOLUTION: A semiconductor device comprises: semiconductor elements 1; metal parts 3 each of which fits inside a circumference of a surface of the semiconductor element 1 where an electrode is formed and includes a convex mounting part 3c having a mounting surface 3a for mounting the semiconductor element 1; and an encapsulation resin 7 for encapsulating the semiconductor elements 1 and the metal parts 3. |
