发明名称 |
Pattern formation method |
摘要 |
A pattern formation method includes a first step of forming a film having a flat surface on an uneven structure including a concave portion exhibiting liquid repellency and a convex portion exhibiting lyophilic properties so as to cover the concave portion and the convex portion; and a second step of forming a pattern by drying the film. |
申请公布号 |
US9193180(B2) |
申请公布日期 |
2015.11.24 |
申请号 |
US201414460261 |
申请日期 |
2014.08.14 |
申请人 |
FUJIFILM Corporation |
发明人 |
Miyamoto Kimiaki |
分类号 |
B41J11/00;H01L27/12;H01L29/786;H01L29/66 |
主分类号 |
B41J11/00 |
代理机构 |
Studebaker & Brackett PC |
代理人 |
Studebaker & Brackett PC |
主权项 |
1. A pattern formation method, comprising:
a first step of forming a film having a flat surface on an uneven structure including a concave portion exhibiting liquid repellency and a convex portion exhibiting lyophilic properties so as to cover the concave portion and the convex portion; and a second step of forming a pattern by drying the film, wherein the film is formed with a coating liquid that satisfies:
σ>0.153p1.947×δ−3.84×|aH|1.022 where surface tension is denoted by σ (N/m); film thickness is denoted by δ (m); pitch of irregularities made up of the concave portion exhibiting liquid repellency and the convex portion exhibiting lyophilic properties is denoted by p (m); and Hamaker constant is denoted by aH (J). |
地址 |
Tokyo JP |