| 发明名称 |
Capacitive load drive circuit |
| 摘要 |
A capacitive load drive circuit, which may be embodied in a printer, includes a movable member; pressure chambers and respective capacitive elements; a first circuit substrate installed outside the movable member, and on which is installed a control signal supply unit that generates control signals; a second circuit substrate installed on the movable member, and on which is installed a circuit that charges or discharges the capacitive elements according to the control signals; and a flexible flat cable, on which is formed wirings including control wiring, which transmits the control signals from the first to the second circuit substrate, and a wiring, which supplies power supply and ground voltages to the second circuit substrate. A total path length of the wirings between the first and second circuit substrates is shorter than the total path length of the wiring between the second circuit substrate and each of the capacitive elements. |
| 申请公布号 |
US9193156(B2) |
申请公布日期 |
2015.11.24 |
| 申请号 |
US201414540133 |
申请日期 |
2014.11.13 |
| 申请人 |
Seiko Epson Corporation |
发明人 |
Otsuka Shuji;Kiyuna Tadashi;Asanuma Toshifumi |
| 分类号 |
B41J2/14;B41J2/045 |
主分类号 |
B41J2/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitive load drive circuit, comprising:
a movable member; pressure chambers, and capacitive elements, one provided for each of the pressure chambers; a first circuit substrate, which is installed outside of the movable member, and on which is installed a control signal supply unit that generates control signals; a second circuit substrate, which is installed on the movable member, and on which is installed a circuit that charges or discharges each of the capacitive elements according to the control signals; and a flexible flat cable, on which is formed a plurality of wirings including control wiring, which transmits the control signals from the first circuit substrate to the second circuit substrate, and a wiring, which supplies a power supply voltage and a ground voltage to the second circuit substrate, wherein a total path length of the plurality of wirings between the first circuit substrate and the second circuit substrate is shorter than the total path length of the wiring between the second circuit substrate and each of the capacitive elements. |
| 地址 |
Tokyo JP |
