CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE-HEIGHT LAYERS

摘要

An IC device manufacturing process performs a planar recessing of a material, which initially changes a height across a substrate. The method comprises: a step for forming a polymer coating; a CMP step for forming a planar surface; and a plasma etching step for performing planar treatment of the polymer coating. The material can be recessed with the polymer coating, or subsequently can provide a mask with the recessed polymer coating. All of the material layers above a certain height are removed. A structure which is substantially lower than the certain height can be protected from contamination and left intact. A polymer can be a photoresist. The polymer can be provided with suitable adhesion and uniformity for the CMP process through a two-step baking process and by exhausting the baking chamber from below the substrate.