DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to provide a dicing tape-integrated film for a semiconductor back surface, restraining that a coloring agent contained in the flip chip type film for a semiconductor back surface formed on an adhesive layer of a dicing tape is transferred to the dicing tape. The present invention comprises: the dicing tape having a base material and having the adhesive layer formed on the base material; the flip chip type film for a semiconductor back surface formed on the adhesive layer of the dicing tape; and the coloring agent. According to the coloring agent, the solubility is not more than 2g/100ml at 23 deg. C with respect to toluene.