发明名称 THE MANUFACTURING METHOD OF THE SUBSTRATE HAVING SILVER PASTE CIRCUIT AND THE SUBSTRATE BOARD
摘要 The present invention relates to a method for manufacturing a substrate with a silver paste circuit part and the substrate manufactured thereby. The method for manufacturing the substrate with the silver paste circuit part includes: a silver paste circuit part formation process of a forming the silver paste circuit part by filling a mold for silver paste including a silver paste filing groove with the silver paste; a process of curing the silver paste circuit part formed by the filled silver paste; a substrate combining process of combining the cured silver paste circuit part with the substrate through an adhesive; and a substrate separating process of separating the substrate combined with the silver paste circuit part from the mold for the silver paste.
申请公布号 KR20150130092(A) 申请公布日期 2015.11.23
申请号 KR20140057224 申请日期 2014.05.13
申请人 KIM, JUNG SIK;SEONG, NAK HOON 发明人 KIM, JUNG SIK;SEONG, NAK HOON
分类号 H05K3/12;H05K3/20 主分类号 H05K3/12
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