NON-CONTACT TYPE DEVICE FOR SUBSTRATE GRIPPING

摘要

The present invention relates to a non-contact substrate gripping device and, more specifically, relates to a non-contact substrate gripping device capable of gripping a substrate with a non-contact state. To achieve this, the present invention provides a non-contact substrate gripping device comprising: a housing which forms an air inlet wherein air is induced on a top and an air outlet connected with the air inlet to discharge the induced air on a lower side maintains a horizontal surface, forming the air outlet to be rounded as a convex shape such that the induced air is discharged along the lower side which forms the horizontal surface; a nozzle unit arranged in an empty space inside the housing, including a constant interval with an inner circumference surface of the housing and an inclined plane in which its width gradually narrows towards an upper side of the air inlet direction from the lower side; and an ultrasonic wave shaker to apply ultrasonic wave vibrations to the housing.