HEAT TREATMENT APPARATUS FOR SUBSTRATE

摘要

The present invention relates to a heat treatment apparatus for a substrate, characterized by comprising a chamber part providing a heat treatment space for a substrate; a shutter part including an upper shutter and a lower shutter opened and closed by being vertically slid independently to allow the substrate enter one or more gate formed on the chamber part; and a rotating part providing a rotation force of sliding the shutter part. Therefore, in the present invention, the gate of the chamber part is opened and closed by the shutter part vertically slid by the rotating part, thereby minimizing an opening and closing space of the gate, reducing heat loss of the chamber part by reducing the gate opening and closing time, and improving heat treatment efficiency of the chamber part.