发明名称 |
HIGH PERFORMANCE DIE ATTACH ADHESIVES (DAA) NANOMATERIALS FOR HIGH BRIGHTNESS LED LED (DAA) |
摘要 |
<p>The present invention relates to a composition for a one-part die attach adhesives material useful for packaging semi-conductors including HB-LED. The composition of the present invention includes a thermal and electrical conductive filler, a polymer matrix and a solvent which form a material with high thermal conductivity, low curing temperature and high self-life temperature. The present invention also relates to a method of preparing said composition by mixing a size-selected and surface-modified filler formulation, a polymer matrix and a non-reactive organic solvent together followed by curing the mixture at a low temperature.</p> |
申请公布号 |
HK1184807(A1) |
申请公布日期 |
2015.11.20 |
申请号 |
HK20130112053 |
申请日期 |
2013.10.25 |
申请人 |
NANO AND ADVANCED MATERIALS INSTITUTE LIMITED |
发明人 |
LIU, CHENMIN;LU, DONG;LANG, XIANXIN;WANG, BO;LI, ZHIYING |
分类号 |
C09J;C08K;C08L |
主分类号 |
C09J |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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