发明名称 COOLING APPARATUS USING THERMOELEMENT MODULE
摘要 The present invention relates to a cooling structure of a cooling apparatus and, more specifically, to a cooling structure of a cooling apparatus, capable of cooling a heat radiating part of a cooling apparatus using a thermoelectric module. According to the present invention, disclosed is the cooling apparatus using a thermoelectric module, comprising: a thermoelectric module part including a first heat exchanging part and a second heat exchanging part separately combined with a heat radiating part and a heat absorbing part of one or more thermoelectric modules (300); a first housing (100) having an internal space for accommodating the first heat exchanging part; a second housing (200) combined with the first housing (100), having an air inlet (210) and an air outlet (220), and having a second flow path (P2) for connecting the air inlet (210) and the air outlet (220); a second air flow forming part (240) for forming air flow in the second flow path (P2) for performing heat exchange of the second heat exchanging part by air flow of the second flow path (P2); and a drainage part (250) installed in the lower side of the second housing (200), and for storing condensed water generated in the second heat exchanging part while heat exchange of the second heat exchanging part is performed.
申请公布号 KR101565559(B1) 申请公布日期 2015.11.20
申请号 KR20150030922 申请日期 2015.03.05
申请人 VORTEX SEMICONDUCTOR INC.;KOREA MIDLAND POWER CO., LTD. 发明人 PARK, SE HOON;YOON, JIN WON
分类号 F25B21/02;F25D21/10 主分类号 F25B21/02
代理机构 代理人
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