| 摘要 |
The present invention relates to a lamination-type semiconductor package using a rewiring layer and a manufacturing method thereof and, more specifically, to a lamination-type semiconductor package using a rewiring layer, in which an upper semiconductor package and a lower semiconductor package are vertically laminated with an interposer interposed therebetween, to realize a decrease in thickness decrease and fine pitch of a ball pad by applying the interposer as a structure having the rewiring layer, and to a manufacturing method thereof. In other words, an interposer which connects the upper and lower semiconductor packages to be conductive is employed as a configuration of a passivation layer and a rewiring layer, and a connection means for lamination of the lower semiconductor package is applied as a metal post, thereby realizing a fine pitch between metal posts, and realizing an increase in the number of ball pads of the interposer and fine pitch between the ball pads. In addition, a connection ball of the interposer is attached onto the lower semiconductor package to be conductive in a manner of pressing through a non-conductive paste (NCP), and adhesive fixing is achieved between the interposer and the lower semiconductor package by the non-conductive paste, thereby preventing a warpage phenomenon, and preventing a phenomenon such as non-wet at the same time. |
