发明名称 放熱構造
摘要 PROBLEM TO BE SOLVED: To provide means for making component cooling by sheet metal more efficient, and making fixation to a substrate sure only by processing of the sheet metal.SOLUTION: A heat sink 10 has: a flat plate part 14; and a stationary leg 15 which stands from a margin of the flat plate part 14 toward a component side 41, corresponds to a fitting hole 42, and of which the tip is folded back to from a return part 15a. In the heat sink 10, distance L10 from a lower surface 11 to a return completion end 15a-1 of the return part 15a is a dimension equal to or less than a total value of thickness B30 of a cooling object component 30 from the component side 41 and thickness B40 of a printed circuit board 40. In the heat sink 10, the stationary leg 15 is inserted into the fitting hole 42, the return completion end 15a-1 penetrates the fitting hole 42 to engage into a rear surface 43 of the printed circuit board 40, the lower surface 11 contacts an upper surface 31 of the cooling object component 30, and is fitted to the printed circuit board 40.
申请公布号 JP2015207569(A) 申请公布日期 2015.11.19
申请号 JP20140085136 申请日期 2014.04.17
申请人 发明人
分类号 H01L23/40;H05K1/02;H05K7/20 主分类号 H01L23/40
代理机构 代理人
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