SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

摘要

A solid state imaging device that includes a substrate having oppositely facing first and second surfaces and a photoelectric conversion unit layer having a light incident side facing away from the substrate. The substrate includes a first photoelectric conversion unit and a second photoelectric conversion and the photoelectric conversion layer includes a third photoelectric conversion unit.

主权项

1. An electronic apparatus, comprising:
an optical system operative to guide incident light; a solid state imaging device that receives light from the optical system, the solid state imaging device including:
a substrate having oppositely facing first and second surfaces;a photoelectric conversion unit layer having a light incident side facing away from the substrate;a first photoelectric conversion unit and a second photoelectric conversion unit within the substrate; anda third photoelectric conversion unit within the photoelectric conversion unit layer, the third photoelectric conversion unit including:
a photoelectric conversion material layer;an upper electrode on a surface of the photoelectric conversion material layer facing a light incident surface; anda lower electrode on a surface of the photoelectric conversion material layer facing the substrate,wherein,
a signal charge in the third photoelectric conversion unit is transferred therefrom via the lower electrode;a driving circuit that drives the solid state imaging device; anda signal processing circuit that processes an output signal of the solid state imaging device.