PACKAGED ANTENNA AND METHOD FOR PRODUCING SAME

摘要

Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a chip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.

主权项

1. An apparatus, comprising:
a chip comprising a semiconductor substrate and an antenna structure provided at a front side of the chip; a chip package comprising an encapsulating material; and a void arranged in the semiconductor substrate below the antenna structure, wherein the apparatus is configured to provide radiation in the direction of the front side of the chip.