| 发明名称 |
HEAT CONVERSION DEVICE |
| 摘要 |
Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate. |
| 申请公布号 |
US2015333246(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201514710946 |
申请日期 |
2015.05.13 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
Lee Jong Min;Kim Sang Gon;Kim Sook Hyun;Kim Chae Hoon;Roh Myoung Lae;Park Joong Hyun;Sohn Hyung Min;Shin Jong Bae;Won Boone;Cho Yong Sang;Jo Yun Kyoung |
| 分类号 |
H01L35/32;H01L35/30 |
主分类号 |
H01L35/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat conversion device, comprising:
a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module comprises: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate. |
| 地址 |
Seoul KR |
