COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MOUNT PACKAGE

摘要

A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

主权项

1. An apparatus including:
a complete power management system comprising: a controller integrated circuit; a power transistor coupled to said controller integrated circuit; a plurality of passive circuit components comprising at least one inductor component and wherein said controller integrated circuit, said power transistor and said plurality of passive circuit components are functionally coupled to implement said complete power management system; and wherein each component of said plurality of passive circuit components is coupled between lead posts of a metal leadframe coupling said controller integrated circuit and said power transistor.