| 摘要 |
A semiconductor optical integrated device including: a substrate having a first area, a second area and a third area arranged in a waveguiding direction; a laser portion disposed on the third area the laser portion including a laser waveguide and a heater thereon; a semiconductor waveguide disposed on the second area, the semiconductor waveguide including a core layer and a cladding layer disposed on the core layer; a Mach-Zehnder modulator portion disposed on the first area, the Mach-Zehnder modulator portion including a first arm and a second arm; a buried region embedding the laser waveguide, the semiconductor waveguide, and the first and second arms; a groove disposed on the second area, the groove extending in a direction intersecting the waveguiding direction to across the semiconductor waveguide to the buried region; and a resin body disposed on the Mach-Zehnder modulator portion. The laser portion is optically coupled to the Mach-Zehnder modulator portion via the semiconductor waveguide. The groove has a bottom on a surface of the core layer of the semiconductor waveguide. |
| 主权项 |
1. A semiconductor optical integrated device comprising:
a substrate having a principal surface including a first area, a second area and a third area arranged in a waveguiding direction; a laser portion disposed on the third area of the substrate, the laser portion including a laser waveguide that includes an active section configured to generate light and a passive section including a heater thereon; a semiconductor waveguide disposed on the second area of the substrate, the semiconductor waveguide including a core layer and a cladding layer disposed on the core layer; a Mach-Zehnder modulator portion disposed on the first area of the substrate, the Mach-Zehnder modulator portion including a first MMI coupler, a first arm, a second arm, a second MMI coupler, a first electrode and a second electrode; a buried region embedding the laser waveguide, the semiconductor waveguide, and the first and second arms of the Mach-Zehnder modulator portion; a groove disposed on the second area of the substrate, the groove extending in a direction intersecting the waveguiding direction to across the semiconductor waveguide to the buried region; and a resin body disposed on the Mach-Zehnder modulator portion, wherein the laser portion is optically coupled to the Mach-Zehnder modulator portion via the semiconductor waveguide, and the groove has a bottom on a surface of the core layer of the semiconductor waveguide. |
