发明名称 |
Physical Quantity Sensor |
摘要 |
A thermal type sensor molded from a mold resin having an opening has a problem in that the residual stress of the mold resin in the opening causes peeling at the interface having poor adhesion. A physical quantity sensor has a construction having a semiconductor chip having a detector unit 3, a frame 8a on which the semiconductor chip is mounted, a mold resin portion 10 which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layer 6 which is formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and which is formed from a metal material that absorbs a stress from the end. |
申请公布号 |
US2015330820(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201314652487 |
申请日期 |
2013.10.15 |
申请人 |
HITACHI AUTOMOTIVE SYSTEMS, LTD. |
发明人 |
SAKUMA Noriyuki |
分类号 |
G01F1/684 |
主分类号 |
G01F1/684 |
代理机构 |
|
代理人 |
|
主权项 |
1. A physical quantity sensor, characterized by having:
a semiconductor chip having a detector unit, a frame on which the semiconductor chip is mounted, a mold resin portion which encapsulates the semiconductor chip and the frame and has an opening through which the detector unit is exposed to the outside, and a stress absorbing layer being formed between an end of the opening in the mold resin portion and a wiring layer formed in the detector unit, and containing a metal material which absorbs a stress from the end. |
地址 |
Hitachinaka-shi, Ibaraki JP |