发明名称 |
APPARATUS FOR COOLING SUBSTRATE |
摘要 |
Provided in the present invention is an apparatus for cooling a substrate. The apparatus for cooling a substrate of the present invention comprises a substrate plate where a substrate is placed; and a first cooling radiator provided under the substrate plate, and cooled by a coolant to indirectly cool the substrate placed on the substrate plate by heat exchange with surrounding air. |
申请公布号 |
KR20150129205(A) |
申请公布日期 |
2015.11.19 |
申请号 |
KR20140055330 |
申请日期 |
2014.05.09 |
申请人 |
PSK INC. |
发明人 |
KIM, YONG SIK;SEO, WON BUM |
分类号 |
H01L23/36;H01L21/683 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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