发明名称 APPARATUS FOR COOLING SUBSTRATE
摘要 Provided in the present invention is an apparatus for cooling a substrate. The apparatus for cooling a substrate of the present invention comprises a substrate plate where a substrate is placed; and a first cooling radiator provided under the substrate plate, and cooled by a coolant to indirectly cool the substrate placed on the substrate plate by heat exchange with surrounding air.
申请公布号 KR20150129205(A) 申请公布日期 2015.11.19
申请号 KR20140055330 申请日期 2014.05.09
申请人 PSK INC. 发明人 KIM, YONG SIK;SEO, WON BUM
分类号 H01L23/36;H01L21/683 主分类号 H01L23/36
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