| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit member which can increase an adhesion strength with an encapsulation resin.SOLUTION: In a circuit member such as a frame material including a die pad for placing a semiconductor chip on a top face and leads electrically connected to the semiconductor chip, which is formed by pattern processing of a rolled copper plate or a rolled copper alloy: a part of the lead on a top face where a bonding wire is connected is a smooth surface and a plating layer is located on the smooth surface; and the top face of the lead where the plating layer does not exist is a rough surface, and an undersurface of the lead is a frame material surface, and the die pad and side wall surfaces of the leads are rough surfaces having surface roughness equal to that of the top face of the lead. |
