PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

摘要

PROBLEM;To provide: a package for housing an electronic component, wherein a metal portion formed of a getter metal material exhibits high bonding strength to an insulating substrate; and an electronic device.;SOLUTION;A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating substrate (1), which is formed of a ceramic sintered body and comprises a recess portion (2), and a wiring conductor (5) which is provided on the insulating substrate (1); and a metal portion (3) which is formed of a sintered body of a getter metal material and is directly bonded to the recess portion (2). An electronic device which is provided with this package for housing an electronic component and an electronic component (6) which is housed within the recess portion (2).

主权项

1. A package for housing an electronic component, comprising:
a substrate part comprising an insulating substrate made from a ceramic sintered body that comprises a recess portion, and a wiring conductor provided on the insulating substrate; and a metal portion made from a sintered body of a getter metal material directly bonded to the recess portion.