| 发明名称 |
OPTICAL SEMICONDUCTOR LIGHTING APPARATUS |
| 摘要 |
An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate. |
| 申请公布号 |
US2015333044(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201514720267 |
申请日期 |
2015.05.22 |
| 申请人 |
POSCO LED COMPANY LTD. |
发明人 |
KIM Kyung-Rye;KOOK Ji Eun;KIM Jung Hwa;KIM Jing Jong;YOO Min Uk;KIM Dae Won;YOON Seong Bok |
| 分类号 |
H01L25/075;H01L33/50;H01L33/54 |
主分类号 |
H01L25/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optical semiconductor lighting apparatus, comprising:
a substrate; a plurality of LED chips disposed in the substrate; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and connecting the first mold portion, wherein the first mold portion comprises: a transparent or translucent resin; and a particle-shape fluorescent material mixed uniformly with the resin. |
| 地址 |
Yongin-si KR |
