Stacked Memory Device Control

摘要

A system for memory device control may include a stacked memory device and a memory controller. The stacked memory device may include a stack of chips connected to a package substrate by electrical interconnects. The stack may include a plurality of memory chips, a primary control chip, and a secondary control chip. The primary and secondary control chips may be electrically connected to the plurality of memory chips by an internal data bus. The primary control chip may have logic to provide an interface between the internal data bus and a first external data bus. The secondary control chip may have logic to provide an interface between the internal data bus and a second external data bus.

主权项

1. A system for memory device control comprising:
a stacked memory device including:
a package substrate configured for placement on a circuit board;a stack of chips connected to the package substrate by electrical interconnects, the stack including:
a plurality of memory chips each having one or more memory storage devices;a primary control chip electrically connected to the plurality of memory chips by an internal data bus, and having logic to provide an interface between the internal data bus and a first external data bus; anda secondary control chip electrically connected to the plurality of memory chips by the internal data bus, and having logic to provide an interface between the internal data bus and a second external data bus.