| 摘要 |
The purpose of the present invention is to provide a method for manufacturing a semiconductor device by which it is possible to miniaturize a package, minimize decreases in the strength of the package, and keep down manufacturing costs. This method for manufacturing a semiconductor device includes: (a) a step for preparing a lead frame having a die pad on which a semiconductor element is mounted; (b) a step for arranging a particulate first resin in a mold; (c) a step for arranging the lead frame inside the mold such that the first resin is in contact with the lower side of the die pad; (d) a step for filling the mold with a second resin over the first resin; and (e) a step for curing the first resin and the second resin, thereby casting the resins. |
