| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of effectively preventing the generation of a void in a sealing resin when the sealing resin is packed in between a semiconductor element and the wiring board after an electrode terminal of a semiconductor element is flip-chip connected to a semiconductor element connection pad.SOLUTION: In a wiring board 100, a wiring conductor 6 including a semiconductor element connection pad 7 is disposed on an insulating layer 1b, and, on the insulating layer 1b and the wiring conductor 6, an upper end part of the semiconductor element connection pad 7 is exposed, and further, a solder resist layer 3a that covers the insulating layer 1b adjacent to the semiconductor element connection pad 7 is coated at a level lower than an upper surface of the semiconductor element connection pad 7. The solder resist layer 3a includes a concave meniscus part B between a side surface of the semiconductor element connection pad 7 and the upper surface of the insulating layer 1b. |
