| 摘要 |
PROBLEM TO BE SOLVED: To increase the degree of freedom in circuit design for mounting an electronic component, in a resin structure embedding an electronic component in a resin molding.SOLUTION: In a resin structure 1 including a resin molding 5, and a plurality of electronic components 2 embedded in the resin molding 5, the resin molding 5 has a plurality of exposed surfaces exposing the electrodes 3 of the electronic components 2, a recess 7 is formed in the resin molding 5, and the bottom surface 13 of the recess 7 is at least one of the plurality of exposed surfaces. |
