| 摘要 |
Provided is a method for producing a semiconductor device, said method making it possible to suppress the occurrence of voids in an interface between an adherend and a sheet-like resin composition, and making it easy to predict an amount of protrusion after mounting. The present invention is a method for producing a semiconductor device that is provided with an adherend, a semiconductor element that is electrically connected to the adherend, and a sheet-like resin composition that fills the space between the adherend and the semiconductor element, said method including a step of preparing a semiconductor element provided with a sheet-like resin composition, said semiconductor element being formed by bonding a sheet-like resin composition to a semiconductor element, and a connection step in which the semiconductor element and the adherend are electrically connected and the space between the adherend and the semiconductor element is filled with the sheet-like resin composition. Therein, the minimum melt viscosity of the sheet-like resin composition at 80-200 °C is 100-3000 Pa·s, inclusive, and the volume (V) of the sheet-like resin composition and the volume (T) required to fill the space between the adherend and the semiconductor element satisfies the belowmentioned formula. 0.85T ≤ V ≤ 1.25T |
