| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated plate and a substrate which can achieve both reduction of warp of a device using a thin wiring board in a core layer and reduction of warp in wiring a thin wiring board.SOLUTION: A laminated plate for plating wiring formation has a resin layer and a metal layer formed by plating and is used in a core layer, and the resin layer has an average thermal expansion coefficient of 4×10/°C in the range of 25-260°C, a thickness of 120 μm or smaller and a resin fraction of 70% or smaller. |
