发明名称 Resistance-Switching Memory Cell With Multiple Raised Structures In A Bottom Electrode
摘要 A reversible resistance-switching memory cell has multiple narrow, spaced apart bottom electrode structures. The raised structures can be formed by coating a bottom electrode layer with nano-particles and etching the bottom electrode layer. The raised structures can be independent or joined to one another at a bottom of the bottom electrode layer. A resistance-switching material is provided between and above the bottom electrode structure, followed by a top electrode layer. Or, insulation is provided between and above the bottom electrode structures, and the resistance-switching material and top electrode layer are above the insulation. Less than one-third of a cross-sectional area of each resistance-switching memory cell is consumed by the one or more raised structures. When the resistance state of the memory cell is switched, there is a smaller area in the bottom electrode for a current path, so the switching resistance is higher and the switching current is lower.
申请公布号 US2015333105(A1) 申请公布日期 2015.11.19
申请号 US201514807370 申请日期 2015.07.23
申请人 SanDisk 3D LLC 发明人 Matamis George;Kai James K.;Purayath Vinod R.;Zhang Yuan;Chien Henry
分类号 H01L27/24;H01L45/00 主分类号 H01L27/24
代理机构 代理人
主权项 1. A resistance-switching memory cell, comprising: a substrate; a bottom electrode layer above the substrate, the bottom electrode layer comprising a plurality of raised structures; a resistance-switching material, a top of each raised structure of the plurality of raised structures is in contact with the resistance-switching material; a top electrode above the resistance-switching material; and an insulating material adjacent to and between the plurality of raised structures, wherein a top of the insulating material is below the top of each raised structure of the plurality of raised structures and the resistance-switching material extends above the plurality of raised structures and the insulating material.
地址 Milpitas CA US