发明名称 |
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE |
摘要 |
In some embodiments, to increase the height-to-pitch ratio of a solder connection that connects different structures with one or more solder balls, only a portion of a solder ball's surface is melted when the connection is formed on one structure and/or when the connection is being attached to another structure. In some embodiments, non-solder balls are joined by an intermediate solder ball (140i). A solder connection may be surrounded by a solder locking layer (1210) and may be recessed in a hole (1230) in that layer. Other features are also provided. |
申请公布号 |
WO2015175554(A2) |
申请公布日期 |
2015.11.19 |
申请号 |
WO2015US30410 |
申请日期 |
2015.05.12 |
申请人 |
INVENSAS CORPORATION |
发明人 |
KATKAR, RAJESH;UZOH, CYPRIAN, EMEKA |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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