发明名称 HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR INSPECTION AND SEMICONDUCTOR INSPECTION METHOD
摘要 Provided is a heat-resistant adhesive sheet in which deformation of the adhesive sheet as a result of heating does not readily occur. The adhesive sheet, which is formed by laminating an adhesive agent layer on a substrate, is characterised in that: the substrate exhibits a heat shrinkage property; the adhesive agent layer includes a (meth)acrylic acid ester copolymer, a photopolymerisable compound, a polyfunctional isocyanate curing agent, and a photopolymerisation initiator; and a tackifying resin is not substantially included. Even if heated, deformation does not occur in this adhesive sheet. Furthermore, a tackifying resin is not substantially included in the adhesive agent, and softening therefore does not occur in the adhesive agent layer, even if heated.
申请公布号 WO2015174381(A1) 申请公布日期 2015.11.19
申请号 WO2015JP63521 申请日期 2015.05.11
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 NAKAJIMA, GOSUKE;KUTSUMI, MASANOBU
分类号 C09J7/02;C09J4/00;C09J11/06;C09J133/04;H01L21/66 主分类号 C09J7/02
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