| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip resistor, provided with a resin thermal stress alleviation layer for alleviating thermal stress at a lower surface side of an insulation substrate, capable of preventing generation of burrs of the thermal stress alleviation layer when the thermal stress alleviation layer is primarily divided.SOLUTION: A chip resistor A includes: a lower surface electrode 40, provided at a lower surface of an insulation substrate 10, formed of a silver thick film; a resin film 42, provided at a lower surface of the lower surface electrode 40, formed of a resin thick film; and a lower surface electrode 44, provided from the lower surface of the lower surface electrode 40 to a lower surface of the resin film 42, formed of a resin silver thick film. The resin film 42 and the lower surface electrode 44 are formed by being separated from an end part in an inter-electrode direction of the insulation substrate 10. |
