发明名称 EXTRUSION APPARATUS AND METHOD OF PRODUCING RESIN FILM
摘要 PROBLEM TO BE SOLVED: To provide an extrusion apparatus capable of adjusting a film thickness profile in a width direction of a T-die to a target value by measuring a thickness of a molten resin or a cooled and solidified film while purging in an off-line operation.SOLUTION: The extrusion apparatus comprises: a film thickness-measuring sensor 21 for measuring a thickness of a molten resin or a film formed by cooling and solidification thereof while purging in an off-line operation; a plurality of lip width-adjusting mechanisms 20 capable of adjusting a lip width of a T-die; and a position-detecting sensor 22 for detecting a position of the film thickness-measuring sensor in a width direction of the T-die, where the lip width adjusting mechanism adjusts a lip width in a width direction of the T-die on the basis of a difference calculated from a film thickness profile in a width direction prepared on the basis of film thickness measuring data obtained by the film thickness-measuring sensor and a film thickness profile in a width direction which is set in advance.
申请公布号 JP2015205449(A) 申请公布日期 2015.11.19
申请号 JP20140087157 申请日期 2014.04.21
申请人 TOPPAN PRINTING CO LTD 发明人 YAMAMURA RYUSHI;AWAKAWA HIDEO;TAKANO YUTO
分类号 B29C47/16;B29C47/92 主分类号 B29C47/16
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