| 发明名称 |
BONDING PAD ARRANGMENT DESIGN FOR MULTI-DIE SEMICONDUCTOR PACKAGE STRUCTURE |
| 摘要 |
A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads. |
| 申请公布号 |
US2015333039(A1) |
申请公布日期 |
2015.11.19 |
| 申请号 |
US201514809482 |
申请日期 |
2015.07.27 |
| 申请人 |
MediaTek Inc. |
发明人 |
LIU Hsing-Chih;YANG Chia-Hao;CHEN Ying-Chih |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package structure, comprising:
a base; a first die mounted on the base, comprising:
a plurality of first pads with a first pad area arranged in a first tier; anda plurality of second pads with a second pad area arranged in a second tier; and a second die mounted on the base, comprising: a plurality of third pads, arranged in a third tier; a first bonding wire having two terminals respectively coupled to one of the first pads and one of the third pads; and a second bonding wire having two terminals respectively coupled to one of the third pads and one of the second pads. |
| 地址 |
Hsin-Chu TW |
