发明名称 Method of Forming High-K Gates Dielectrics
摘要 A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; injecting a first precursor and forming an interfacial layer on the substrate; and injecting a second precursor and performing a thermal treatment for forming an interface layer on the interfacial layer.
申请公布号 US2015332926(A1) 申请公布日期 2015.11.19
申请号 US201414280654 申请日期 2014.05.18
申请人 UNITED MICROELECTRONICS CORP. 发明人 Ke Jian-Cun;Yang Chih-Wei;Hsu Chia-Fu
分类号 H01L21/28;H01L29/66 主分类号 H01L21/28
代理机构 代理人
主权项 1. A method for fabricating semiconductor device, comprising: providing a substrate; injecting a first precursor and forming an interfacial layer on the substrate; and injecting a second precursor and performing a thermal treatment for forming an interface layer on the interfacial layer after forming the interfacial layer on the substrate, wherein the thickness of the interface layer is 1/10 of the total thickness of the interfacial layer and the interface layer.
地址 Hsin-Chu City TW