发明名称 |
Method of Forming High-K Gates Dielectrics |
摘要 |
A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; injecting a first precursor and forming an interfacial layer on the substrate; and injecting a second precursor and performing a thermal treatment for forming an interface layer on the interfacial layer. |
申请公布号 |
US2015332926(A1) |
申请公布日期 |
2015.11.19 |
申请号 |
US201414280654 |
申请日期 |
2014.05.18 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Ke Jian-Cun;Yang Chih-Wei;Hsu Chia-Fu |
分类号 |
H01L21/28;H01L29/66 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating semiconductor device, comprising:
providing a substrate; injecting a first precursor and forming an interfacial layer on the substrate; and injecting a second precursor and performing a thermal treatment for forming an interface layer on the interfacial layer after forming the interfacial layer on the substrate, wherein the thickness of the interface layer is 1/10 of the total thickness of the interfacial layer and the interface layer. |
地址 |
Hsin-Chu City TW |