发明名称 |
COMPOUND SEMICONDUCTOR SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a compound semiconductor substrate which can satisfy both of high performance and reliability of a semiconductor element while suppressing a film thickness of an entire compound semiconductor layer.SOLUTION: A compound semiconductor substrate comprises: a silicon single crystal substrate 12; a first semiconductor layer 16 having a carbon concentration of not less than 1×10/cmand not more than 1×10/cm; a barrier layer 18 which has a carbon concentration equal to or less than 5×10/cmand has bandgap energy larger than that of the first semiconductor layer 16; a second semiconductor layer 20 which has a carbon concentration equal to or less than 5×10/cmand has bandgap energy smaller than that of the barrier layer; and a third semiconductor layer 22 having bandgap energy larger than that of the second semiconductor layer. The first semiconductor layer and the barrier layer are lattice matched to each other at a first boundary surface. The barrier layer and the second semiconductor layer are lattice matched to each other at a second boundary surface. Bandgap energy inside the barrier layer is larger than bandgap energy of the barrier layer at the first boundary surface and larger than bandgap energy of the barrier layer at the second boundary surface. |
申请公布号 |
JP2015207771(A) |
申请公布日期 |
2015.11.19 |
申请号 |
JP20150113463 |
申请日期 |
2015.06.03 |
申请人 |
COVALENT MATERIALS CORP |
发明人 |
ERIGUCHI KENICHI;KOMIYAMA JUN;OISHI KOJI;ABE YOSHIHISA;YOSHIDA AKIRA;SUZUKI SHUNICHI |
分类号 |
H01L21/338;H01L21/205;H01L29/778;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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