| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of effectively dissipating heat generated by electronic components to the outside of a housing.SOLUTION: An electronic apparatus according to an embodiment includes a housing and an electronic substrate. The electronic substrate is mounted with electronic components and is inserted into the housing in an attachable/detachable manner. A first heat transfer member having a first contact surface is arranged on the housing. A second heat transfer member having a second contact surface is arranged on the electronic substrate. The first contact surface and the second contact surface overlap each other as seen from the insertion direction of the electronic substrate, and are in contact with each other in a state where the electronic substrate is inserted in the housing. |
