| 摘要 |
PROBLEM TO BE SOLVED: To enhance uniformity of the thickness of a superposed substrate, by controlling an adhesive protruding from between substrates, when bonding the substrates.SOLUTION: Positions in the horizontal direction of a processed wafer applied with adhesive and a support wafer are adjusted, and the processed wafer and the support wafer are arranged oppositely (step A8). Subsequently, the processed wafer and the support wafer are pressed with a first pressure, and the adhesive and the support wafer are abutted (step A9). Thereafter, the processed wafer and the support wafer are pressed with a second pressure smaller than the first pressure, and the film thickness of the adhesive is adjusted (step A10). Finally, the processed wafer and the support wafer are pressed with a third pressure larger than the first pressure, and bonded (step A11). |
