发明名称 RIGID FLEXIBLE BOARD
摘要 PROBLEM TO BE SOLVED: To provide: a method for manufacturing a rigid flexible board, which does not involve the step of sticking coverlay films to a flexible part and a rigid part respectively as executed in the known art and which enables the cost cutting by sticking a coverlay film to a flexible part and a rigid part collectively at a time in lamination; and a rigid flexible board obtained according to the method for manufacturing a rigid flexible board.SOLUTION: A rigid flexible board comprises: a rigid part; a flexible part; and a coverlay film laminated thereon and serving as an outermost layer of the rigid part and an outermost layer of the flexible part. The coverlay film is laminated on the rigid part and the flexible part in one thermocompression step. The coverlay film includes a laminate structure arranged by laminating an adhesion layer (II) to a polyimide layer (I) having a tensile elasticity of 2.5 GPa or less, an elongation percentage of 50% or more, and a thickness of 15 μm or less.
申请公布号 JP2015207656(A) 申请公布日期 2015.11.19
申请号 JP20140087200 申请日期 2014.04.21
申请人 MITSUI CHEMICALS INC 发明人 TOMITA YUSUKE;IMAGAWA KIYOMI;KOBA SHIGEO
分类号 H05K3/46;C08G73/10;H05K3/28 主分类号 H05K3/46
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