| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern formation method which comprises forming a pattern on a support, baking the pattern, and transferring the pattern to a desirable substrate with e.g. an adhesive, and improves transferability without impairing characteristics of the pattern, e.g. conductivity.SOLUTION: A pattern formation method includes forming a pattern of a specified shape with first particles on a support, arranging second particles on the pattern, baking the pattern, together with the arranged second particles, and transferring the baked pattern to a substrate through the second particles and the adhesive on the pattern. The baking temperature Tin the baking step meets expression (1): T≤T<T, where Tis the baking-possible temperature of the first particles; and Tis the boundary temperature at which irregularities on the pattern due to the particle shape of the second particles disappear. |
