| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device that can accurately detect a metal film remaining as residue at a surface to be polished of a post-polished substrate.SOLUTION: The substrate treatment device includes: a polishing part 3 for removing the metal film formed at the surface to be polished after polishing the surface to be polished of the substrate; a cleaning part 4 for cleaning and drying the substrate polished by the polishing part 3; and a temporarily placing table 180 on which the substrate is temporarily placed after being polished by the polishing part 3. The temporarily placing table 180 is provided with sensors 8, 9 for detecting the metal film remaining at the surface to be polished of the substrate. |
