发明名称 METHOD OF MANUFACTURING WIRING BOARD, WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board including connection terminals having enhanced connection reliability with other component such as an electronic component, in a wiring board having a laminate of one or more conductor layer and insulating layer, and to provide a method of manufacturing the same.SOLUTION: A method of manufacturing a wiring board has a step for preparing a laminate of one or more conductor layer and insulating layer, a step for forming a first metal layer on the surface layer of the laminate by electrolytic plating, and a step for forming a second metal layer on the first metal layer, by applying a conductive paste containing metallic particles selected from Cu, Ag, Au or alloy particles of these metals.
申请公布号 JP2015207722(A) 申请公布日期 2015.11.19
申请号 JP20140088740 申请日期 2014.04.23
申请人 NGK SPARK PLUG CO LTD 发明人 INOUE MASAHIRO
分类号 H05K3/34 主分类号 H05K3/34
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