发明名称 |
PEELING METHOD OF ELECTRODEPOSITED COPPER |
摘要 |
PROBLEM TO BE SOLVED: To provide a peeling method of electrodeposited copper, capable of reducing time required for peeling the electrodeposited copper.SOLUTION: A peeling method of electrodeposited copper comprises: a cutting step for cutting so that at least part of a laminate layer is cut by copper electrolytic refining, with respect to a lower end of the electrodeposited copper which is formed on both sides of a plate-state cathode and a lower end of the cathode; and a peeling step for peeling the electrodeposited copper from the cathode. |
申请公布号 |
JP2015206101(A) |
申请公布日期 |
2015.11.19 |
申请号 |
JP20140089020 |
申请日期 |
2014.04.23 |
申请人 |
PAN PACIFIC COPPER CO LTD |
发明人 |
MATSUDA MASARU;HATTORI TAKESHI;NITTA TSUTOMU |
分类号 |
C25C7/08;C25C1/12 |
主分类号 |
C25C7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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