发明名称 PEELING METHOD OF ELECTRODEPOSITED COPPER
摘要 PROBLEM TO BE SOLVED: To provide a peeling method of electrodeposited copper, capable of reducing time required for peeling the electrodeposited copper.SOLUTION: A peeling method of electrodeposited copper comprises: a cutting step for cutting so that at least part of a laminate layer is cut by copper electrolytic refining, with respect to a lower end of the electrodeposited copper which is formed on both sides of a plate-state cathode and a lower end of the cathode; and a peeling step for peeling the electrodeposited copper from the cathode.
申请公布号 JP2015206101(A) 申请公布日期 2015.11.19
申请号 JP20140089020 申请日期 2014.04.23
申请人 PAN PACIFIC COPPER CO LTD 发明人 MATSUDA MASARU;HATTORI TAKESHI;NITTA TSUTOMU
分类号 C25C7/08;C25C1/12 主分类号 C25C7/08
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