SENSOR INTEGRATION WITH AN OUTGASSING BARRIER AND A STABLE ELECTRICAL SIGNAL PATH

摘要

The present disclosure relates to a structure and method of forming a MEMS-CMOS integrated circuit with an outgassing barrier and a stable electrical signal path. An additional poly or metal layer is embedded within the MEMS die to prevent outgassing from the CMOS die. Patterned conductors formed by a damascene process and a direct bonding between the two dies provide a stable electrical signal path.

主权项

1. An integrated circuit (IC) comprising:
a semiconductor die comprising a first top surface and a first bottom surface; a MEMS die comprising a second top surface and a second bottom surface, wherein the MEMS die is disposed over the semiconductor die, and the first top surface is coupled to the second top surface; a cap bonded to the second bottom surface defining a cavity between the MEMS die and the cap; and an outgas barrier layer disposed within the MEMS die configured to prevent outgassing from the semiconductor die to the cavity.