PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

A photosensitive resin composition which comprises a binder polymer as component (A), one or more photopolymerizable compounds as component (B), and a photopolymerization initiator as component (C), wherein the component (B) comprises a photopolymerizable compound, as component (B1), that has a polyalkylene oxide [-(CmH2mO)n-; m and n are each independently a number of 2 or larger] as a structural unit and that has a double bond equivalent of 700 or greater, the content of the component (B1) in the total amount of the components (A) and (B) being 5 mass% or greater.